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sml-d12x1 series data sheet features outline ? i v rank reduction products size dimensions recommended solder pattern speci?cations typ. i f max. v r min.* 2 typ. max.* 2 i f min. typ. i f (v) (ma) ( a) (v) (nm) (nm) (nm) (ma) (mcd) (mcd) (ma) 625 630 635 25 40 615 620 625 40 63 602 605 608 587 590 593 569 572 575 16 30 red p d (mw) i f (ma) 5 20 20 63 100 orange yellow 54 20 100* 1 5 -40 ? 85 -40 ? +100 2.2 20 10 algainp SML-D12V1W sml-d12u1w yellowish green reverse operating temp. storage temp. *1:duty1/10, 1khz *2:measurement tolerance 1nm i fp (ma) v r (v) part no. chip structure absolute maximum ratings (ta=25oc) electrical and op tical characteristics (ta=25oc) power forward peak forward forward voltage v f reverse current i r dominant wavelength d luminous intensity i v dissipation t opr (oc) t stg (oc) emitting color current current voltage sml-d12d1w sml-d12y1w sml-d12m1w tolerance : 0.1 (unit : mm) (unit : mm) 1608 (0603) 1.6 0.8mm (t=0.55mm) color type v u d y m r 0 . 1 5 r 0 . 2 7 5 1 . 5 1 . 6 1 . 2 0 . 8 0. 5 5 0. 8 0. 5 0 . 6 5 0 .1 8 0.8 0.85 0.8 0.8 pcb bonding direction ?????????????????????????????????????????????????? ???? www.rohm.com ?2016 rohm co., ltd. all rights reserved 1/9 2017.6 - rev.004
[data sheet] electrical characteristics curves fig.1 forward current fig.2 luminous intensity - - forward voltages atmosphere temperature fig.3 luminous intensity - forward current fig.4 derating reference [sml-d12x1 series] 0 10 20 30 -40-30-20-10 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 1.0 1.5 0 5 10 15 20 0.4 0.6 0.8 1 1.2 1.4 1.6 -40-30-20-10 0 10 20 30 40 50 60 70 80 90100 1 10 100 1.0 1.5 2.0 2.5 3.0 ta=25oc forward current : i f [ma] forward voltage : v f [v] i f =20ma relative luminous intensity [a.u.] atmosphere temperature : ta [oc] ta=25oc relative luminous intensity forward current : i f [ma] maximum forward current : [ma] ambient temperature : ta [oc] SML-D12V1W sml-d12u1w sml-d12d1w sml-d12y1w sml-d12m1w sml -d12v1w sml -d12u1w sml -d12d1w sml -d12y1w sml -d12m1w SML-D12V1W sml-d12u1w sml-d12d1w sml-d12y1w sml-d12m1w SML-D12V1W sml-d12u1w sml-d12d1w sml-d12y1w sml-d12m1w ?????????????????????????????????????????????????? ???? www.rohm.com ?2016 rohm co., ltd. all rights reserved 2/9 2017.6 - rev.004
[data sheet] viewing angle reference [sml-d12x1 series] scanning angle (deg) scanning angle (deg) relative intensity (%) relative intensity (%) 10 10 20 20 40 50 70 80 40 50 70 80 0 50 100 50 100 0 30 60 90 30 60 90 x - y scanning direction 10 10 20 20 40 50 70 80 40 50 70 80 0 50 100 50 100 0 30 60 90 30 60 90 x - y scanning direction sml -d12v1w sml -d12u1w sml -d12d1w sml -d12y1w sml -d12m1w ?????????????????????????????????????????????????? ???? www.rohm.com ?2016 rohm co., ltd. all rights reserved 3/9 2017.6 - rev.004
[data sheet] rank reference of brightness* *measurement tolerance:10% [sml-d12x1 series] red (v, u) (ta=25oc, i f 20ma) rank j k l m n p q r s iv (mcd) 2.5?4.0 4.0?6.3 6.3?10 10?16 16?25 25?40 40?63 63?100 100?1 60 SML-D12V1W sml-d12u1w orange(d) (ta=25oc, i f 20ma) rank j k l m n p q r s iv (mcd) 2.5?4.0 4.0?6.3 6.3?10 10?16 16?25 25?40 40?63 63?100 100?1 60 sml-d12d1w yellow (y) (ta=25oc, i f 20ma) rank j k l m n p q r s iv (mcd) 2.5?4.0 4.0?6.3 6.3?10 10?16 16?25 25?40 40?63 63?100 100?1 60 sml-d12y1w yellowish green(m) (ta=25oc, i f 20ma) rank j k l m n p q r s iv (mcd) 2.5?4.0 4.0?6.3 6.3?10 10?16 16?25 25?40 40?63 63?100 100?1 60 sml-d12m1w ?????????????????????????????????????????????????? ???? www.rohm.com ?2016 rohm co., ltd. all rights reserved 4/9 2017.6 - rev.004
[data sheet] taping(t86) unit: note)tolerance is within 0.2mm unless otherwise specified. part no. construction packing speci?cation rohm led products are being shipped with desiccant (silica gel) included in moisture-proof bags. or enclosing the humidity indication card inside th e bag is available upon request. please contact the nearest sales office or distribu ter if necessary. [sml-d12x1 series] pasting the moisture sensitive label on the outer s urface of the moisture-proof bags 8.0 1.75 3.5 5.5 00.5 1 2 1.9 180 60 13 0.1 0.05 1.5 0.1 0.1 +1 0 -3 0 0.05 0 0.73 4 packing quantity 3,000pcs/reel pull direction 11.4 1 +0.1 -0.07 +0.1 -0.07 0.1 0 . 2 0 . 0 5 *"-"will be taken out for emitting color special cod e will be applied for chromaticity rank rank sign wb/b/e series. emitting color wb/b/e series. (for white led (bright ness rank)* series name package type chip type emitting color resin color tapin g specification sml p1 0 v t e1 1 u w d1 2 u2 b h1 3 d m1 4 y3 01 5 y2 notices1 series81 seires z1/zn 6 y a1 7 w 81/82 8 m2 k1 m *concerning the brightness rank. s1 f *please refer to the rank chart above for p2 p luminous intensity classification. 52 e *part name is individual for each rank. p34 b *when shipped as sample,the part name will p36 wb be a representative part name. vn t general products are free of ranks. rgb please contact sales if rank appointment scm 01 is needed. for white led, csthode at sprocket hole side transparent colorless t86 cathode at sprocket hole side(the top) anode at sprocket hole side(the top) milkey white t87 1 black 3 red/green/blue 3.0x1.5 t=2.2mm 3.5x2.8 t=0.6mm phototransistors chip led 1.0x1.0 t=0.2mm blue 1.5x1.0 t=0.2mm white 1.3x1.5 t=0.6mm green 3.2x1.6 t=1.85mm green 1.0x1.0 t=0.2mm green 4.5x2.0 t=0.6mm yellowish green cathode at sprocket hole side(the back) 1.6x1.15 t=0.55mm t68 cathode at sprocket hole side(the top) t86 ultra high brightness type 3.0x2.0 t=1.3mm 3.5x2.8 t=1.9mm yellowish green yellow 3.4x1.25 t=1.1mm 2.0x1.25 t=0.8mm yellow yellow yellow orange high brightness type red chip led 1.0x0.6 t=0.2mm 1.6x0.8 t=0.36mm red 1.6x0.8 t=0.55mm low current type red p standard type 1 s m l d 6 2 v 1 w t 8 ?????????????????????????????????????????????????? ???? www.rohm.com ?2016 rohm co., ltd. all rights reserved 5/9 2017.6 - rev.004
[data sheet] storage if the product is heated during the reflow under th e condition of hygroscopic state, it may vaporize and expand which will influence the performance of the product. therefore, the package is waterproof. please use th e product following the conditions: ?using conditions ?baking bake the product in case of below: the expiration date is passed. the indicator of hic(humidity indicator card) beco me discolored immediately after the mbb is opened. the color of indicator (silica gel) turned from bl ue to colorless or from green to pink. ?baking conditions application methods precaution for drive system and o? mode design the circuit without the electric load exceed ing the absolute maximum rating that please do not apply voltage neither forward nor rev erse. especially, for the products with the ag-paste used in the die bonding, theres high poss ibility to cause electro migration and result derating the derating characteristics are based on the life time of luminous intensity and assumption of degradation & color change of sealing resin or r eflector. about its reliability, operation life span theres possibility for intensity of light drop acc ording to working conditions and environments (applied current, surrounding temperature and humi dity, corrosive gases), please call our sales longtime intensity of light life on mode all the time applied stress on product no resin hardening agent such as filler is used in the sealing resin of the product. therefore, please pay attention to the overstress o n it which may influence its reliability. usage the product is led. we are not responsible for the usage as the diode such as protection chip, classification please storing in the airtight container temperature time humidity ?bake products in reel. ?reel and embossed tape are easy to be deformed whe n baking, before using 5?30 30?60%rh within 1 year from receiving storage with waterproof package precaution (surface mount device) after opening package 5?30 below 60%rh within 168h remark [sml-d12x1 series] temperature humidity expiration date with our desiccant (silica gel) (even if the product is within the expiration date. ) 603 12?24h below 20%rh remark so please try not to apply stress on it. ?recommend bake once. applies on the products. if drive by constant volta ge, it may cause current deviation of the led and result in deviation of luminous intensity, so we re commend to drive by constant current. (deviation of vf value will cause deviation of cur rent in led.) furthermore, for off mode, in function failure. please evaluate its using conditions and environmen t and use it after confirmed there is no problem. staffs for inquiries about the concerned applicati on below. in ordinary electronic equipment, so that we do not guarantee the usage in devices requiring extremely high reliability (such as car equipment, medical equipment, traffic equipment, aircraft etc.). rectifier, switching and so on. the product is desi gned and manufactured for application ?????????????????????????????????????????????????? ???? www.rohm.com ?2016 rohm co., ltd. all rights reserved 6/9 2017.6 - rev.004
[data sheet] others surrounding gas notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or alkali gas (ammonia), it may result in low solderin g ability (caused by the change in quality of the plating surface ) or optical characteristics ch anges (light intensity, chrominance) and change in quality of cause die bonding (ag-paste) material s. all of the above will function failure of therefore, please pay attention to the storage envi ronment for mounted product (concern the electrostatic damage the product is part of semiconductor and electrosta tic sensitive, theres high possibility to be damag ed by the electrostatic discharge. please take appropr iate measures to avoid the static electricity from human body and earthing of production equipment. th e resistance values of electrostatic discharge (actual values) vary with products, therefore, ple ase call our sales staffs for inquiries. electromagnetic wave applications with strong electromagnetic wave such as, ih cooker, will influence the reliability of le d, therefore please evaluate before using it. [sml-d12x1 series] the products. generated gas of the surrounding parts of the produ cts and the atmospheric environment). ?????????????????????????????????????????????????? ???? www.rohm.com ?2016 rohm co., ltd. all rights reserved 7/9 2017.6 - rev.004
[data sheet] stress strength according to he mounting position: abcd so please pay attention to the touch on product. we recommend the soldering pattern that shows on th e right. it will be different according to mounting situatio n of circuit board, therefore, please concern before designing. the product has adopted the electrode structure th at it should solder with back electrode of the product. thus, please be informed that the shape of electrod e pin of solder fillet formation is not guaranteed. the through hole on electrode surface is for conduc tion of front and rear electrodes but not for formation of sold er ?llet. . automatic mounting vibration may result in low mounting rate since it will cause the static electricity of product and adhere to top cover tape. we recommend to ?set magnet on parts feeder cassette of the mo unter to control the product stabilization ?set ionizer to prevent electrostatic charge . mounting location the stress like bending stress of circuit board div iding after mounting, may cause led package crack or damage of led internal junction, therefore, plea se concern the mounting direction and position to avoid bending or screwing with great stress of the circuit board. expansion and moisture absorption at humidity will cause heat stress during soldering process and finally has bad influence on the products reliabi lity. ?the product is not guaranteed for ?ow soldering. ?do not expose the product in the environment of hi gh temperature (over 100) or rapid temperature shift (within 3/sec. of temperature gradient) du ring the flow soldering of surrounding parts. ?please set appropriate re?ow temperature based on our product usage conditions and speci?cation. ?the max for re?owing is 2 times, please ?nish the second re?ow soldering and ?ow soldering with other parts within the usage limitation after open the moistureproof package. ?compare with n2 re?ow, during air re?ow, because o f the heat and surrounding conditions, it may cause the discoloration of the resin. [sml-d12x1 series] mounting . soldering ?no resin hardening agent such as ?ller is used in the sealing resin of the product. therefore, resin in case of carrying out flow soldering of surround ing parts without recommended conditions, please contact us for inquiries. D. mechanical stress after mounting the mechanical stress may damage the led after circ uit mounting, soldering pattern for recommendation 0.8mm 0.85mm 0.8mm 0.8mm pcb bonding direction ?????????????????????????????????????????????????? ???? www.rohm.com ?2016 rohm co., ltd. all rights reserved 8/9 2017.6 - rev.004
[data sheet] sufficiently with your cleaning conditions [sml-d12x1 series] re?ow pro?le for re?ow pro?le, please refer to the conditions be low:() meaning of marks, conditions mark meanings conditions ts max maximum of pre-heating temperature 180 ts min minimum of pre-heating temperature 140 t s time from tsmin to tsmax over 60sec. under 3/sec. t d /t temperature decreasing rate over -3/sec. t l reference temperature 230?260 t l retention time for tl within 40sec. t p peak temperature 260(max) t p time for peak temperature within 10sec. t r /t temperature rising rate condition ) temp. of iron top less than 400 within 3 sec. b) handling after soldering please handle after the part temp. goes down to room temp. cleaning after soldering please follow the conditions below if the cleaning is necessary after soldering and evaluate above conditions are for reference. therefore, eva luate by customers own circuit boards and reflow furnaces before using, because stress from c ircuit boards and temperature variations of reflow attention points in soldering operation this product was developed as a surface mount led e specially suitable for reflow soldering. so reflow soldering is recommended. in case of impl ementing manual soldering, please take care of following points. solder used hand soldering condition led products do not contain reinforcement material such as a glass fillers. recommended condition ultrasonic cleaning 15wbelow 1 liter (capacity of tank) drying under 100 within 3 minutes furnaces vary by customers own conditions. so thermal stress by soldering greatly influence it s reliability. please keep following points for manual soldering. item a) heating method solvent we recommend to use alcohols solvent such as, isopr opyl alcohols temperature under 30 within 3 minutes heating on pcb pattern, not direct to the led. (fig-1) sn-cusn-ag-cusn-ag-bi-cu fig-1 soldering land soldering iron ?????????????????????????????????????????????????? ???? www.rohm.com ?2016 rohm co., ltd. all rights reserved 9/9 2017.6 - rev.004
r1102 a www.rohm.com ? 201 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes the information contained herein is subject to change without notice. before you use our products, please contact our sales representative and verify the latest specifica- tions : although rohm is continuously working to improve product reliability and quality, semicon- ductors can break down and malfunction due to various factors. therefore, in order to prevent personal injury or fire arising from failure, please take safety measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures. rohm shall have no responsibility for any damages arising out of the use of our poducts beyond the rating specified by rohm. examples of application circuits, circuit constants and any other information contained herein are provided only to illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. the technical information specified herein is intended only to show the typical functions of and examples of application circuits for the products. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm or any other parties. rohm shall have no responsibility whatsoever for any dispute arising out of the use of such technical information. the products are intended for use in general electronic equipment (i.e. av/oa devices, communi- cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in this document. the products specified in this document are not designed to be radiation tolerant. for use of our products in applications requiring a high degree of reliability (as exemplified below), please contact and consult with a rohm representative : transportation equipment (i.e. cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems. do not use our products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters. rohm shall have no responsibility for any damages or injury arising from non-compliance with the recommended usage conditions and specifications contained herein. rohm has used reasonable care to ensur the accuracy of the information contained in this document. however, rohm does not warrants that such information is error-free, and rohm shall have no responsibility for any damages arising from any inaccuracy or misprint of such information. please use the products in accordance with any applicable environmental laws and regulations, such as the rohs directive. for more details, including rohs compatibility, please contact a rohm sales office. rohm shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations. when providing our products and technologies contained in this document to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the us export administration regulations and the foreign exchange and foreign trade act. this document, in part or in whole, may not be reprinted or reproduced without prior consent of rohm. 1) 2) 3) 4) 5) 6) 7) 8) 9) 10) 11) 12) 13) 14)
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